Electronic Ceramic Substrate

The substrate has the advantages of small volume good heat dissipation low thermal resistance and no pollution.

Electronic ceramic substrate.

It is widely used in thick film circuit semiconductor refrigeration device power electronic devices power electronic device such as cpu integrated module. The role of the substrate in power electronics is to provide the interconnections to form an electric circuit like a printed circuit board and to cool the components. We are passionate for ceramic technology and our customers. The ceramic substrate material is widely used in electronic packaging substrate for its advantages such as high strength good insulation good thermal conductivity and heat resistance small thermal expansion coefficient and good chemical stability.

Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al 2 o 3. The advantages of alumina include high resistivity good mechanical and dielectric strength excellent thermal and corrosion stability and the ability to provide hermetic seals. Compared to materials and techniques used in lower power microelectronics these substrates must carry higher currents and provide a higher voltage isolation up to several thousand volts.